MEMS materials and processes handbook / (Record no. 33242)

000 -LEADER
fixed length control field 01837cam a22003977a 4500
001 - CONTROL NUMBER
control field 16626316
003 - CONTROL NUMBER IDENTIFIER
control field OSt
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20211021103124.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 110127s2011 nyua b 001 0 eng
010 ## - LIBRARY OF CONGRESS CONTROL NUMBER
LC control number 2011921730
015 ## - NATIONAL BIBLIOGRAPHY NUMBER
National bibliography number GBB047220
Source bnb
016 7# - NATIONAL BIBLIOGRAPHIC AGENCY CONTROL NUMBER
Record control number 015523393
Source Uk
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780387473161 (hbk.)
035 ## - SYSTEM CONTROL NUMBER
System control number (OCoLC)ocn587110610
038 ## - RECORD CONTENT LICENSOR
Staff Name khadija
040 ## - CATALOGING SOURCE
Original cataloging agency UKM
Transcribing agency UKM
Modifying agency BTCTA
-- YDXCP
-- INT
-- VLB
-- DLC
042 ## - AUTHENTICATION CODE
Authentication code lccopycat
050 00 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TJ163
Item number .M46 2011
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Edition number 22
Author Mark MEM
245 00 - TITLE STATEMENT
Title MEMS materials and processes handbook /
Statement of responsibility, etc. Reza Ghodssi, Pinyen Lin, editors.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. New York ;
-- London :
Name of publisher, distributor, etc. Springer,
Date of publication, distribution, etc. c2011.
300 ## - PHYSICAL DESCRIPTION
Extent xxxv, 1187 p. :
Other physical details ill. ;
Dimensions 24 cm.
490 1# - SERIES STATEMENT
Series statement MEMS reference shelf
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes bibliographical references and index.
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note The MEMS design process -- Additive processes for semiconductors and dielectric materials -- Additive processes for metals -- Additive processes for polymeric materials -- Additive processes for piezoelectric materials : piezoelectric MEMS -- Materials and processes in shape memory alloy -- Dry etching for micromachining applications -- MEMS wet-etch processes and procedures -- MEMS lithography and micromachining techniques -- Doping processes for MEMS -- Wafer bonding -- MEMS packaging materials -- Surface treatment and planarization -- MEMS process integration.
563 ## - BINDING INFORMATION
Binding note Hardcover
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Microelectromechanical systems
General subdivision Materials.
9 (RLIN) 83310
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Microelectromechanical systems.
9 (RLIN) 55756
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Ghodssi, Reza.
9 (RLIN) 83311
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Lin, Pinyen.
9 (RLIN) 83312
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title MEMS reference shelf.
9 (RLIN) 83313
906 ## - LOCAL DATA ELEMENT F, LDF (RLIN)
a 7
b cbc
c copycat
d 2
e ncip
f 20
g y-gencatlg
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme
Koha item type Book
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Permanent Location Current Location Shelving location Date acquired Total Checkouts Full call number Barcode Date last seen Date last checked out Price effective from Koha item type
          School of Mechanical & Manufacturing Engineering (SMME) School of Mechanical & Manufacturing Engineering (SMME) General Stacks 01/18/2016 1 621.381 MEM SMME-1983 03/29/2018 01/09/2018 01/18/2016 Book
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