Topology Optimization of High-Power Electronics Enclosures using Generative Design & Additive Manufacturing / (Record no. 607286)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02097nam a22001577a 4500 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 670 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Jamil, Atif |
| 245 ## - TITLE STATEMENT | |
| Title | Topology Optimization of High-Power Electronics Enclosures using Generative Design & Additive Manufacturing / |
| Statement of responsibility, etc. | Atif Jamil |
| 264 ## - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Islamabad : |
| Name of producer, publisher, distributor, manufacturer | SMME- NUST; |
| Date of production, publication, distribution, manufacture, or copyright notice | 2023. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 63p. |
| Other physical details | Soft Copy |
| Dimensions | 30cm |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | The development of electronic devices towards high performance and miniaturization has led<br/>to an increase in the heat dissipation problem. Traditional air-cooling methods are no longer<br/>sufficient to meet the high-density heat dissipation requirements. The thermal design optimization<br/>of heat sinks is necessary to minimize size and weight and improve heat removal, which can<br/>increase the speed of electronic devices. The use of sophisticated technology and proper design of<br/>heat sinks is crucial to avoid overheating and damage to electronic components. Porous metal has<br/>been shown to enhance forced convection heat transfer for better heat removal. However, the highpressure drop associated with porous medium also needs to be considered in the design. The<br/>effective thermal management of heat sinks is a priority concern for researchers as overheating<br/>can threaten chip reliability and lifespan. The average heat flux of chips has increased from 50<br/>W/cm2 in 2010 to 250 W/cm2 in 2012, which highlights the importance of effective thermal<br/>management. In addition, the use of micro-channel compact heat exchangers and flow boiling in<br/>mini- and micro channels have been suggested as effective cooling methods for high power density<br/>devices such as Micro Electromechanical Systems (MEMS), microprocessors, laser diode arrays<br/>and Light Emitting Diodes (LEDs). In this study, we will be investigating the effect of nontraditional geometries of heat-sinks for high power electronics used in aerospace applications. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | MS Design and Manufacturing Engineering |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Supervisor : Dr. Syed Hussain Imran Jaffery |
| 856 ## - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="http://10.250.8.41:8080/xmlui/handle/123456789/37551">http://10.250.8.41:8080/xmlui/handle/123456789/37551</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | |
| Koha item type | Thesis |
| Withdrawn status | Permanent Location | Current Location | Shelving location | Date acquired | Full call number | Barcode | Koha item type |
|---|---|---|---|---|---|---|---|
| School of Mechanical & Manufacturing Engineering (SMME) | School of Mechanical & Manufacturing Engineering (SMME) | E-Books | 12/11/2023 | 670 | SMME-TH-909 | Thesis |