Diffusion Bonding of Ferrous Alloys and their Characterization / (Record no. 607299)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02264nam a22001697a 4500 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | NUST |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 670 |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Muhammad Hussain, Mian |
| 245 ## - TITLE STATEMENT | |
| Title | Diffusion Bonding of Ferrous Alloys and their Characterization / |
| Statement of responsibility, etc. | Mian Muhammad Hussain |
| 264 ## - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Islamabad : |
| Name of producer, publisher, distributor, manufacturer | SMME- NUST; |
| Date of production, publication, distribution, manufacture, or copyright notice | 2023. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 73p. ; |
| Other physical details | Soft Copy |
| Dimensions | 30cm. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Diffusion bonding is a solid-state joining technique that fuses two materials together by applying<br/>pressure and heat. The atoms from one material diffuse into the other as a result of the high pressure<br/>and temperature, joining the two materials together. The diffused atoms form bond interface.<br/>Diffusion bonding is a desirable option for applications that call for high strength, because the<br/>bond formed is extremely durable and resistant to fracture. Plates of High Strength Low Alloy<br/>Steel (HSLA) were successfully bonded by diffusion bonding process with interlayer of Beryllium<br/>Copper between them. Beryllium copper alloys produces a bond that is both strong and thermally<br/>stable, which makes it suitable for high-temperature applications. Research on diffusion bonding<br/>is being done to optimize the diffusion bonding variables to achieve maximum tensile strengths.<br/>The strength was achieved at temperatures, 750°C, 800°C and 850°C for hold time 1hr 2hr and<br/>3hr under the pressure of 20Mpa. Prior to the bonding process, the materials need to be cleaned<br/>and properly prepared in order to achieve successful diffusion bonding. This involves eliminating<br/>any contaminants and surface flaws that might adversely affect the bond. In this study samples<br/>were first cleaned by ethanol in ultrasonic cleaner for 30 minutes, secondly the samples are grinded<br/>on different emery papers ranging from p240, p600, p800, p1000, p1500, p2000 to achieve smooth<br/>even surface. Diffusion bond interface has been analyzed by scanning electron microscopy (SEM)<br/>to check the interface of joined plates. X-Ray diffraction (XRD) technique is used to determine<br/>the internal stresses. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | MS Design and Manufacturing Engineering |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Supervisor : Dr. Shahid Ikramullah Butt |
| 856 ## - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="http://10.250.8.41:8080/xmlui/handle/123456789/36581">http://10.250.8.41:8080/xmlui/handle/123456789/36581</a> |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | |
| Koha item type | Thesis |
| Withdrawn status | Permanent Location | Current Location | Shelving location | Date acquired | Full call number | Barcode | Koha item type |
|---|---|---|---|---|---|---|---|
| School of Mechanical & Manufacturing Engineering (SMME) | School of Mechanical & Manufacturing Engineering (SMME) | E-Books | 12/11/2023 | 670 | SMME-TH-897 | Thesis |