Introduction to microelectronic Fabrication / Richard C. Jaeger.
Series: Modular series on solid state devices (Upper Saddle River, N.J.): Publisher: Upper Saddle River, N.J. : Prentice Hall, c2002Edition: vol 5Description: xiv,232 p. : ill. ; 24 cmISBN: 0201146959Subject(s): Telecommunication EngineeringDDC classification: 621.38152,JAE
Contents:
An Overview of Microelectronic Fabrication (Page-1), Lithography (Page-13), Thermal Oxidation of Silicon (Page-29), Diffusion (Page-49), Ion Implantations (Page-89), Film Deposition (Page-107), Interconnections and Contacts (Page-133), Packing and Yield (Page-153), MOS Process Integration (Page-173), Bipolar Process Integration (Page-201).
| Item type | Current location | Home library | Shelving location | Call number | URL | Status | Notes | Date due | Barcode | Item holds |
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Military College of Signals (MCS) | Military College of Signals (MCS) | General Stacks | 621.38152,JAE (Browse shelf) | Link to resource | Available | Almirah No.33, Shelf No.5 | MCS575 |
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| 621.38152,GHA VLSI fabrication principles : silicon and gallium arsenide / | 621.38152,GHA VLSI fabrication principles : silicon and gallium arsenide / | 621.38152,HAS Analog VLSI design nMOS and CMOS / | 621.38152,JAE Introduction to microelectronic Fabrication / | 621.38152,JON Solid semiconductors / | 621.38152,JON Solid semiconductors / | 621.38152,LAN Power electronics / |
An Overview of Microelectronic Fabrication (Page-1), Lithography (Page-13), Thermal Oxidation of Silicon (Page-29), Diffusion (Page-49), Ion Implantations (Page-89), Film Deposition (Page-107), Interconnections and Contacts (Page-133), Packing and Yield (Page-153), MOS Process Integration (Page-173), Bipolar Process Integration (Page-201).
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