VLSI technology / edited by S.M. Sze.
Series: McGraw-Hill series in electrical engineeringPublisher: New York : McGraw-Hill, c1988Edition: 2nd edDescription: xii, 676 p. : ill. ; 25 cmISBN: 0070627355 :Subject(s): Integrated circuits -- Very large scale integrationDDC classification: 621.395.VLS Online resources: Publisher description | Table of contents
Contents:
Crystal Growth and Wafer Preparation (Page-9), Epitaxy (Page-55), Oxidation (Page-98), Lithography (Page-141), Reactive Plasma Etching (Page-184), Dielectric and Polysilicon Film Deposition (Page-233) Diffusion (Page-272), Ion Implantation (Page-327), Metallization (Page-375), Process Simulation (Page-422), VLSI Process Integration (Page-466), Analytical Techniques (Page-516), Assembly Techniques and Packaging of VLSI Devices (Page-566), Yield and Reliability (Page-612).
| Item type | Current location | Home library | Shelving location | Call number | URL | Status | Notes | Date due | Barcode | Item holds |
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Book
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Military College of Signals (MCS) | Military College of Signals (MCS) | General Stacks | 621.395,VLS (Browse shelf) | Link to resource | Available | Almirah No.40, Shelf No.4 | MCS32657 | ||
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Book
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Military College of Signals (MCS) | Military College of Signals (MCS) | General Stacks | 621.395,VLS (Browse shelf) | Link to resource | Available | Almirah No.40, Shelf No.4 | MCS764 |
Total holds: 0
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| 621.395,TIM Timing solutions : Low skew clock drivers & clock generation circuits / | 621.395,UYE Introduction to VLSI circuits and systems (Include CD) / | 621.395,VLS VLSI technology / | 621.395,VLS VLSI technology / | 621.395,VLS VLSI circuit layout : theory and design / | 621.395,WAR Digital design: principles and practices / | 621.395,WAR Principles of Logic Design / |
Crystal Growth and Wafer Preparation (Page-9), Epitaxy (Page-55), Oxidation (Page-98), Lithography (Page-141), Reactive Plasma Etching (Page-184), Dielectric and Polysilicon Film Deposition (Page-233) Diffusion (Page-272), Ion Implantation (Page-327), Metallization (Page-375), Process Simulation (Page-422), VLSI Process Integration (Page-466), Analytical Techniques (Page-516), Assembly Techniques and Packaging of VLSI Devices (Page-566), Yield and Reliability (Page-612).
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