Advances in electronic circuit packaging Vol-2 / Gerald A. Walker
Publisher: New York Englewood, Colo., Rogers 1962Description: 381 pDDC classification: 621.38132,ADV| Item type | Current location | Home library | Shelving location | Call number | URL | Status | Notes | Date due | Barcode | Item holds |
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Military College of Signals (MCS) | Military College of Signals (MCS) | General Stacks | 621.38132,ADV (Browse shelf) | Available | Almirah No.32, Shelf No.3 | MCS6473 | |||
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Book
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Military College of Signals (MCS) | Military College of Signals (MCS) | General Stacks | 621.38132,ADV (Browse shelf) | Link to resource | Available | Almirah No.32, Shelf No.3 | MCS5505 |
Materials for Electronic Packaging (Page-1), Controlling the Mechanical Response of Printed Circuits Boards (Page-21), A Low Density Potting Compound (Page-35), An Effective use of Castings in a Lightweight (Page-52), Heat Sinks and Encapsulates for Volumetric Packing (Page-61), Potting Problems Related to Packing Design (Page-77), Packing of Semiconductor Networks (Page-91),Theremal packing for Transient Operation (Page-104), Formulation and Solution of the Circuit Card Design Problems (Page-121), Maintainable Electronic Component Assemblies (Page-143), Electronic Packing (Page-166), Packing of a Telemeter to Withstand (Page-181),
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