High-speed VLSI interconnections (E Book) [Elektronisk resurs] / Ashok K. Goel.
Series: Wiley series in microwave and optical engineering: Publisher: Hoboken, N.J. : Wiley-Interscience : IEEE Press, c2007Edition: 2nd edDescription: 1 online resource (xix, 407 p.) : illISBN: 9780470165973; 9780470165973Subject(s): COMPUTERS -- Logic Design | Integrated circuits -- Very large scale integration -- Computer simulation | Semiconductors -- Junctions | TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Logic | TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- VLSI & ULSI | Very high speed integrated circuits -- Defects -- Mathematical models | Very high speed integrated circuits -- Mathematical modelsGenre/Form: Electronic books. | Electronic books.DDC classification: 621.39/5 Online resources: John Wiley | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online| Item type | Current location | Home library | Collection | Call number | URL | Status | Date due | Barcode | Item holds |
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Military College of Signals (MCS) | Military College of Signals (MCS) | NFIC | 621.395 (Browse shelf) | Link to resource | Available | MCSEB-1756 |
High-Speed VLSI Interconnections; Contents; PREFACE; 1 Preliminary Concepts and More; 2 Parasitic Resistances, Capacitances, and Inductances; 3 Interconnection Delays; 4 Crosstalk Analysis; 5 Electromigration-Induced Failure Analysis; 6 Future Interconnections; INDEX;
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections. In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a par.

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