Aarea Array Packaging Materials: Adhesives, Paster, and Lead- Free
Material type:
TextPublisher: New York: Mcgraw-Hill 2004ISBN: 9780071428286Subject(s): Aarea Array Packaging MaterialsDDC classification: 621.381046 GIL
| Item type | Current location | Home library | Shelving location | Call number | Status | Date due | Barcode | Item holds |
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College of Electrical & Mechanical Engineering (CEME) | College of Electrical & Mechanical Engineering (CEME) | Text Books | 621.381046 GIL (Browse shelf) | Available | CEME-41331 | ||
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College of Electrical & Mechanical Engineering (CEME) | College of Electrical & Mechanical Engineering (CEME) | General Stacks | 621.381046 GIL (Browse shelf) | Available | CEME-41332 |
Total holds: 0
Browsing College of Electrical & Mechanical Engineering (CEME) shelves, Shelving location: Text Books Close shelf browser
| 621.31924 ALE Fundamentals of Electric Circuits | 621.366 ABI Principles of Laser Materials Processing | 621.381 ELE Electronics Manufacturing: With Lead Free, Halogen Free & Conductive- Adhesive Materials | 621.381046 GIL Aarea Array Packaging Materials: Adhesives, Paster, and Lead- Free | 621.3815 BOY Electronic Devices and Circuit Theory | 621.3815 BOY Electronic Devices and Circuit Theory | 621.3815 BOY Electronic Devices and Circuit Theory |
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