Area Array Packaging Materials Adhesive, Pestes, and Lead- Free
Material type:
TextPublisher: New York: McGraw-Hill, 2004ISBN: 9780071428286Subject(s): Area Array Packaging MaterialsDDC classification: 621.38104
| Item type | Current location | Home library | Shelving location | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Book
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College of Electrical & Mechanical Engineering (CEME) | College of Electrical & Mechanical Engineering (CEME) | General Stacks | 621.38104 GIl (Browse shelf) | Available | CEME- 41969 |
Total holds: 0
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