01482    a2200205   4500003000500000005001700005010001600022020001500038040000900053082001600062100002400078245007000102250001200172260004300184300003300227505081900260650003501079856008801114856007401202Nust20220810105821.0  a   99056617  a047137685X  cNust00a621.381,STE1 aSteinberg, Dave S.,10aVibration analysis for electronic equipment /cDave S. Steinberg.  a3rd ed.  aNew York :bJohn Wiley & Sons,cc2000.  axx, 414 p. :bill. ;c25 cm.  aIntroduction,(Page-1), Vibrations of Simple Electronic Systems (Page-17), Component Lead Wire and Solder Joint Vibrations  Fatigue Life (Page-39), Beam Structures for Electronic Sub (Page-56), Component Lead Wires ad Bents, Frames and Arcs (Page-75), Printed Circuits Boards and Flat Plates (Page-103), Octave Rule, Snubbing and Damping (Page-150), Preventing Sinusoidal Vibration (Page-166), Designing Electronic  for Random Vibration (Page-188), Acoustic Noise Effects on electronic (Page-234).  Designing Electronic for Stock Environments (Page-248), Design and Analysis of Elec Boxes (Page-300), Effects of Manu acting Methods on the Reliability (Page-330), Vibration Fixtures and Vibration Testing (Page-346), Vibration Testing Case Histories (Page-369), Environmental Stress Screening for Elec (Page-379)     0aTelecommunication Engineering.423Publisher descriptionuhttp://www.loc.gov/catdir/description/wiley039/99056617.html423Table of Contentsuhttp://www.loc.gov/catdir/toc/onix06/99056617.html