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  <titleInfo>
    <title>Laser material processing</title>
  </titleInfo>
  <name type="personal">
    <namePart>Steen, W. M.</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <typeOfResource/>
  <originInfo>
    <place>
      <placeTerm type="text">London</placeTerm>
    </place>
    <place>
      <placeTerm type="text">New York</placeTerm>
    </place>
    <publisher>Springer</publisher>
    <dateIssued>1998</dateIssued>
    <edition>2nd ed.</edition>
    <issuance/>
  </originInfo>
  <physicalDescription>
    <extent>xiv, 346 p. : ill. ; 24 cm.</extent>
  </physicalDescription>
  <tableOfContents>Background and General Applications (Page-11), Basic Laser Optics (Page-58),	Laser Cutting(Page-103),	 	Laser Welding (Page-147), Heat Flow Theory (Page-190), Laser Surface Treatment(Page-218), Rapid prototyping and Low Volume Manufacture (Page-272),Laser Automation and In-Process Sensing (Page-293),	 	Laser Safety (Page-321).	</tableOfContents>
  <note type="statement of responsibility">William M. Steen.</note>
  <subject authority="lcsh">
    <topic>Lasers</topic>
    <topic>Industrial applications</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Prototypes, Engineering</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Telecommunication Engineering</topic>
  </subject>
  <classification authority="ddc">621.366,STE</classification>
  <identifier type="isbn">3540761748 (Berlin : alk. paper)</identifier>
  <identifier type="lccn">97046601</identifier>
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    <recordChangeDate encoding="iso8601">20221116164855.0</recordChangeDate>
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