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  <titleInfo>
    <title>Failure mechanisms in semiconductor devices</title>
  </titleInfo>
  <name type="personal">
    <namePart>Amerasekera, E. A.</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
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  </name>
  <name type="personal">
    <namePart>Campbell, D. S.</namePart>
  </name>
  <typeOfResource/>
  <originInfo>
    <place>
      <placeTerm type="text">Chichester [West Sussex]</placeTerm>
    </place>
    <place>
      <placeTerm type="text">New York</placeTerm>
    </place>
    <publisher>Wiley</publisher>
    <dateIssued>c1987</dateIssued>
    <issuance/>
  </originInfo>
  <physicalDescription>
    <extent>xiii, 205 p. : ill. ; 24 cm.</extent>
  </physicalDescription>
  <tableOfContents>Introduction (Page-1), Reliability Theory (Page-5), Failure Mechanisms (Page-12), Failure Mechanisms and Device Technologies (Page-66), Packing (Page-93), Screening (Page-105), Accelerated Testing (Page-116), Physical Failure Analysis Technology (Page-121), Reliability Prediction and Failure Modeling (Page-129), Quality Assurance (Page-135), Conclusions (Page-143). </tableOfContents>
  <note type="statement of responsibility">E.A. Amerasekera and D.S. Campbell.</note>
  <subject authority="lcsh">
    <topic>Telecommunication Engineering</topic>
  </subject>
  <classification authority="ddc">621.38152,AME</classification>
  <identifier type="isbn">0471914347 :</identifier>
  <identifier type="lccn">86028174</identifier>
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