01306    a2200241   4500003000500000005001700005010001600022020001700038040000900055082001800064100003000082245008700112260005900199300003500258505037300293650003400666700002800700856008900728856009000817942001200907999001900919952012600938Nust20221130111430.0  a   86028174  a0471914347 :  cNust00a621.38152,AME1 aAmerasekera, E. A.96933710aFailure mechanisms in semiconductor devices /cE.A. Amerasekera and D.S. Campbell.  aChichester [West Sussex] ;aNew York :bWiley,cc1987.  axiii, 205 p. :bill. ;c24 cm.  aIntroduction (Page-1), Reliability Theory (Page-5), Failure Mechanisms (Page-12), Failure Mechanisms and Device Technologies (Page-66), Packing (Page-93), Screening (Page-105), Accelerated Testing (Page-116), Physical Failure Analysis Technology (Page-121), Reliability Prediction and Failure Modeling (Page-129), Quality Assurance (Page-135), Conclusions (Page-143).  0aTelecommunication Engineering1 aCampbell, D. S.9103815423Publisher descriptionuhttp://www.loc.gov/catdir/enhancements/fy0607/86028174-d.html423Table of contents onlyuhttp://www.loc.gov/catdir/enhancements/fy0607/86028174-t.html  2ddccBK  c182219d182219  00102ddc4070aMCSbMCScGENd2016-12-12o621.38152,AMEpMCS7390r2016-12-08w2016-12-12yBKzAlmirah No.33, Shelf No.4