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  <titleInfo>
    <title>Intermediate Electronic fabrication</title>
    <subTitle>an introduction to printed circuit board construction volume II of III</subTitle>
  </titleInfo>
  <name type="personal">
    <namePart>J. A. Markum</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <typeOfResource/>
  <originInfo>
    <place>
      <placeTerm type="text">Calfornia</placeTerm>
    </place>
    <publisher>The technical education press</publisher>
    <dateIssued>1976</dateIssued>
    <issuance/>
  </originInfo>
  <physicalDescription>
    <extent>192p</extent>
  </physicalDescription>
  <tableOfContents>Safety (Page-7), An Introduction to The P.C Board (Page-13), P.C Board Familiarization (Page-19), Component Layout and the Trace Outline (Page-33), The Introduction to PCB Artwork (Page-49), PCB Master Artwork (Page-61), Scotchal Film Negative (Page-79), Preliminary P.C Board (Page-85), P.C Board Etching (Page-91), P.C.B Stripping. Tinning (Page-97), PCB Components Mounting (Page-103), Complex PCB (Page-111), PCB Outlining (Page-125), Double Sided PCB Fabrications (Page-137), 2x and 4x Artwork (Page-153), The Camera and Films (Page-167), Films Developing and Processes (Page-175), Photosensitive Positive Acting (Page-181), Plated Through Holes (Page-184).</tableOfContents>
  <subject>
    <topic>Telecommunication Engineering</topic>
  </subject>
  <classification authority="ddc">621.38153,MAR</classification>
  <recordInfo>
    <recordContentSource authority="marcorg"/>
    <recordChangeDate encoding="iso8601">20221202123904.0</recordChangeDate>
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