<?xml version="1.0" encoding="UTF-8"?>
<mods xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://www.loc.gov/mods/v3" version="3.1" xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-1.xsd">
  <titleInfo>
    <title>Circuits, interconnections, and packaging for VLSI</title>
  </titleInfo>
  <name type="personal">
    <namePart>Bakoglu, H. B.</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <typeOfResource/>
  <originInfo>
    <place>
      <placeTerm type="text">Reading, Mass</placeTerm>
    </place>
    <publisher>Addison-Wesley Pub. Co.</publisher>
    <dateIssued>c1990</dateIssued>
    <issuance/>
  </originInfo>
  <physicalDescription>
    <extent>xiv, 527 p. : ill. ; 24 cm.</extent>
  </physicalDescription>
  <tableOfContents>Introduction (Page-1), VLSI Devices and Interconnections (Page-17), Packaging Technologies (Page-81), Interconnection Capacitance (Page-134), Interconnection Resistance (Page-194), Transmission Lines (Page-226) Cross Talk and power Distribution Noise (Page-281), Clocking of High Speed Systems (Page-338), System Level Performance Modeling (Page-394).    </tableOfContents>
  <note type="statement of responsibility">H.B. Bakoglu.</note>
  <subject authority="lcsh">
    <topic>Electronic packaging</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Integrated circuits</topic>
    <topic>Very large scale integration</topic>
    <topic>Design and construction</topic>
  </subject>
  <classification authority="ddc">621.395,BAK</classification>
  <relatedItem type="series">
    <titleInfo>
      <title>VLSI systems series</title>
    </titleInfo>
  </relatedItem>
  <identifier type="isbn">0201060086 :</identifier>
  <identifier type="lccn">87022964</identifier>
  <recordInfo>
    <recordContentSource authority="marcorg"/>
    <recordChangeDate encoding="iso8601">20221227135007.0</recordChangeDate>
  </recordInfo>
</mods>
