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  <titleInfo>
    <title>The Technology of Printed Circuits</title>
    <subTitle>The foil Technique in electronic production</subTitle>
  </titleInfo>
  <name type="personal">
    <namePart>Paul Eisler</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <typeOfResource/>
  <originInfo>
    <place>
      <placeTerm type="text">london</placeTerm>
    </place>
    <publisher>Heywood</publisher>
    <dateIssued>1959</dateIssued>
    <issuance/>
  </originInfo>
  <physicalDescription>
    <extent>405p;</extent>
  </physicalDescription>
  <tableOfContents>The Basic Story of Printed Circuits (Page-1), The Confused Start of a New Technology (Page-7), The Principles of Method Selection and the Foil Tech (Page-28), Watching Printed Circuits Production (Page-42), Form the Drawing to the Photo-Stencil (Page-72), Litho Printing  (Page-90), Photomechanical Printing Processes (Page-96), Plating and the Foil Tech (Page-111),  Ancillary Operations (Page-132), Laboratory Routine (Page-146), Design (Page-159), Conventional Components for Assembly (Page-185), Printed Circuits Trouble Shooting (Page-192), Automatic Assembly in the Electronic (Page-205), Regeneration of Ferric Chloride (Page-223), Weight Saving and Heat Dissipation (Page-232), Miniaturization  (Page-242), Oriented Components (Page-253), Microwave Printed Circuits (Page-281), Printed Circuits and The Electronics Industry (Page-303).  </tableOfContents>
  <note type="statement of responsibility">Paul Eisler</note>
  <subject>
    <topic>Telecommunication Engineering</topic>
  </subject>
  <classification authority="ddc">621.38153,EIS</classification>
  <recordInfo>
    <recordContentSource authority="marcorg"/>
    <recordChangeDate encoding="iso8601">20221202115606.0</recordChangeDate>
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