01433    a2200181   4500003000500000005001700005040000900022082001800031100002400049245010100073260002600174300001000200505085000210650003401060942001201094999001901106952012601125Nust20221202115606.0  cNust  a621.38153,EIS  aPaul Eisler9104004  aThe Technology of Printed Circuits :bThe foil Technique in electronic production /cPaul Eisler  alondonbHeywoodc1959  a405p;  aThe Basic Story of Printed Circuits (Page-1), The Confused Start of a New Technology (Page-7), The Principles of Method Selection and the Foil Tech (Page-28), Watching Printed Circuits Production (Page-42), Form the Drawing to the Photo-Stencil (Page-72), Litho Printing  (Page-90), Photomechanical Printing Processes (Page-96), Plating and the Foil Tech (Page-111),  Ancillary Operations (Page-132), Laboratory Routine (Page-146), Design (Page-159), Conventional Components for Assembly (Page-185), Printed Circuits Trouble Shooting (Page-192), Automatic Assembly in the Electronic (Page-205), Regeneration of Ferric Chloride (Page-223), Weight Saving and Heat Dissipation (Page-232), Miniaturization  (Page-242), Oriented Components (Page-253), Microwave Printed Circuits (Page-281), Printed Circuits and The Electronics Industry (Page-303).    aTelecommunication Engineering  2ddccBK  c193556d193556  00102ddc4070aMCSbMCScGENd2016-12-12o621.38153,EISpMCS5527r2016-12-08w2016-12-12yBKzAlmirah No.34, Shelf No.2