01038 a2200157 4500 Nust 20221124131715.0 Nust 621.38132,ADV Gerald A. Walker 103499 Advances in electronic circuit packaging Vol-2 / Gerald A. Walker New York Englewood, Colo., Rogers 1962 381 p Materials for Electronic Packaging (Page-1), Controlling the Mechanical Response of Printed Circuits Boards (Page-21), A Low Density Potting Compound (Page-35), An Effective use of Castings in a Lightweight (Page-52), Heat Sinks and Encapsulates for Volumetric Packing (Page-61), Potting Problems Related to Packing Design (Page-77), Packing of Semiconductor Networks (Page-91),Theremal packing for Transient Operation (Page-104), Formulation and Solution of the Circuit Card Design Problems (Page-121), Maintainable Electronic Component Assemblies (Page-143), Electronic Packing (Page-166), Packing of a Telemeter to Withstand (Page-181), ddc BK 194129 194129 0 0 ddc 0 0 MCS MCS GEN 2016-12-12 621.38132,ADV MCS5505 2016-12-08 2016-12-12 BK Almirah No.32, Shelf No.3 0 0 ddc 0 0 MCS MCS GEN 2022-11-24 0 621.38132,ADV MCS6473 2022-11-24 2022-11-24 BK Almirah No.32, Shelf No.3