TY  - GEN
AU  - Gerald A. Walker
TI  - Advances in electronic circuit packaging Vol-2
U1  - 621.38132,ADV 
PY  - 1962///
CY  - New York 
PB  - Englewood, Colo., Rogers
N1  - Materials for Electronic Packaging (Page-1), Controlling the Mechanical Response of Printed Circuits Boards (Page-21), A Low Density Potting Compound (Page-35), An Effective use of Castings in a Lightweight (Page-52), Heat Sinks and Encapsulates for Volumetric Packing (Page-61), Potting Problems Related to Packing Design (Page-77), Packing of Semiconductor Networks (Page-91),Theremal packing for Transient Operation (Page-104), Formulation and Solution of the Circuit Card Design Problems (Page-121), Maintainable Electronic Component Assemblies (Page-143), Electronic Packing (Page-166), Packing of a Telemeter to Withstand (Page-181)
ER  -