TY  - GEN
AU  - Goel,Ashok K.
TI  - High-speed VLSI interconnections (E Book)
T2  - Wiley series in microwave and optical engineering
SN  - 9780470165973
U1  - 621.39/5 
PY  - 2007///
CY  - Hoboken, N.J.
PB  - Wiley-Interscience, IEEE Press
KW  - COMPUTERS
KW  - Logic Design
KW  - Integrated circuits
KW  - Very large scale integration
KW  - Computer simulation
KW  - Semiconductors
KW  - Junctions
KW  - TECHNOLOGY & ENGINEERING
KW  - Electronics
KW  - Circuits
KW  - Logic
KW  - VLSI & ULSI
KW  - Very high speed integrated circuits
KW  - Defects
KW  - Mathematical models
KW  - Electronic books
N1  - High-Speed VLSI Interconnections; Contents; PREFACE; 1 Preliminary Concepts and More; 2 Parasitic Resistances, Capacitances, and Inductances; 3 Interconnection Delays; 4 Crosstalk Analysis; 5 Electromigration-Induced Failure Analysis; 6 Future Interconnections; INDEX
N2  - This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections. In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a par
UR  - http://dx.doi.org/10.1002/9780470165973
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