<?xml version="1.0" encoding="UTF-8"?>
<record
    xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
    xsi:schemaLocation="http://www.loc.gov/MARC21/slim http://www.loc.gov/standards/marcxml/schema/MARC21slim.xsd"
    xmlns="http://www.loc.gov/MARC21/slim">

  <leader>01859cam a2200349 a 4500</leader>
  <controlfield tag="001">10190379</controlfield>
  <controlfield tag="003">Nust- CAS-E</controlfield>
  <controlfield tag="005">20180118181402.0</controlfield>
  <controlfield tag="006">m        d        </controlfield>
  <controlfield tag="007">cr  n         </controlfield>
  <controlfield tag="008">120502s2012    waua    sb    001 0 eng d</controlfield>
  <datafield tag="020" ind1=" " ind2=" ">
    <subfield code="a">9780819490926</subfield>
  </datafield>
  <datafield tag="020" ind1=" " ind2=" ">
    <subfield code="a">081949092X</subfield>
  </datafield>
  <datafield tag="035" ind1=" " ind2=" ">
    <subfield code="a">(WaSeSS)ssj0000819238</subfield>
  </datafield>
  <datafield tag="040" ind1=" " ind2=" ">
    <subfield code="a">DLC</subfield>
    <subfield code="c">DLC</subfield>
    <subfield code="d">DLC</subfield>
    <subfield code="d">WaSeSS</subfield>
  </datafield>
  <datafield tag="050" ind1=" " ind2="4">
    <subfield code="a">TK7871.85</subfield>
    <subfield code="b">.X53 2012</subfield>
  </datafield>
  <datafield tag="082" ind1="0" ind2="0">
    <subfield code="a">621.3815/2</subfield>
    <subfield code="2">23</subfield>
    <subfield code="b">XIA 2012</subfield>
  </datafield>
  <datafield tag="100" ind1="1" ind2=" ">
    <subfield code="a">Xiao, Hong.</subfield>
  </datafield>
  <datafield tag="210" ind1="1" ind2="0">
    <subfield code="a">Introduction to semiconductor technology</subfield>
  </datafield>
  <datafield tag="245" ind1="1" ind2="0">
    <subfield code="a">Introduction to semiconductor technology</subfield>
    <subfield code="h">[electronic resource] /</subfield>
    <subfield code="c">Hong Xiao.</subfield>
  </datafield>
  <datafield tag="250" ind1=" " ind2=" ">
    <subfield code="a">2nd ed.</subfield>
  </datafield>
  <datafield tag="260" ind1=" " ind2=" ">
    <subfield code="a">Bellingham, Wash. :</subfield>
    <subfield code="b">SPIE,</subfield>
    <subfield code="c">c2012.</subfield>
  </datafield>
  <datafield tag="504" ind1=" " ind2=" ">
    <subfield code="a">Includes bibliographical references and index.</subfield>
  </datafield>
  <datafield tag="505" ind1="0" ind2=" ">
    <subfield code="a">Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index.</subfield>
  </datafield>
  <datafield tag="506" ind1=" " ind2=" ">
    <subfield code="a">License restrictions may limit access.</subfield>
  </datafield>
  <datafield tag="650" ind1=" " ind2="0">
    <subfield code="a">Semiconductors</subfield>
    <subfield code="x">Design and construction.</subfield>
  </datafield>
  <datafield tag="650" ind1=" " ind2="0">
    <subfield code="a">Semiconductor industry.</subfield>
  </datafield>
  <datafield tag="773" ind1=" " ind2="0">
    <subfield code="t">SPIE Digital Library (Books)</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2="0">
    <subfield code="u">http://www.columbia.edu/cgi-bin/cul/resolve?clio10190379</subfield>
    <subfield code="z">Full text available from SPIE Digital Library (Books)</subfield>
  </datafield>
  <datafield tag="910" ind1=" " ind2=" ">
    <subfield code="a">Library of Congress record</subfield>
  </datafield>
  <datafield tag="942" ind1=" " ind2=" ">
    <subfield code="2">ddc</subfield>
    <subfield code="c">BK</subfield>
  </datafield>
  <datafield tag="999" ind1=" " ind2=" ">
    <subfield code="c">355457</subfield>
    <subfield code="d">355457</subfield>
  </datafield>
  <datafield tag="952" ind1=" " ind2=" ">
    <subfield code="0">0</subfield>
    <subfield code="1">0</subfield>
    <subfield code="2">ddc </subfield>
    <subfield code="4">0</subfield>
    <subfield code="7">0</subfield>
    <subfield code="8">NFIC</subfield>
    <subfield code="a">CAS-E</subfield>
    <subfield code="b">CAS-E</subfield>
    <subfield code="c">GEN</subfield>
    <subfield code="d">2013-11-11</subfield>
    <subfield code="e">Eagle Information Books</subfield>
    <subfield code="l">0</subfield>
    <subfield code="o">621.3815/2 XIA 2012</subfield>
    <subfield code="p">CAS-E0000442</subfield>
    <subfield code="r">2014-08-27</subfield>
    <subfield code="w">2014-08-27</subfield>
    <subfield code="y">BK</subfield>
  </datafield>
</record>
