<?xml version="1.0" encoding="UTF-8"?>
<mods xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://www.loc.gov/mods/v3" version="3.1" xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-1.xsd">
  <titleInfo>
    <title>Introduction to semiconductor technology</title>
  </titleInfo>
  <titleInfo type="abbreviated">
    <title>Introduction to semiconductor technology</title>
  </titleInfo>
  <name type="personal">
    <namePart>Xiao, Hong.</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <typeOfResource>text</typeOfResource>
  <genre authority="marc">bibliography</genre>
  <originInfo>
    <place>
      <placeTerm type="code" authority="marccountry">wau</placeTerm>
    </place>
    <place>
      <placeTerm type="text">Bellingham, Wash</placeTerm>
    </place>
    <publisher>SPIE</publisher>
    <dateIssued>c2012</dateIssued>
    <dateIssued encoding="marc">2012</dateIssued>
    <edition>2nd ed.</edition>
    <issuance>monographic</issuance>
  </originInfo>
  <language>
    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
  </language>
  <physicalDescription>
    <form authority="marcform">electronic</form>
    <form authority="gmd">electronic resource</form>
  </physicalDescription>
  <tableOfContents>Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index.</tableOfContents>
  <note type="statement of responsibility">Hong Xiao.</note>
  <note>Includes bibliographical references and index.</note>
  <note>License restrictions may limit access.</note>
  <subject authority="lcsh">
    <topic>Semiconductors</topic>
    <topic>Design and construction</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Semiconductor industry</topic>
  </subject>
  <classification authority="lcc">TK7871.85 .X53 2012</classification>
  <classification authority="ddc" edition="23">621.3815/2 XIA 2012</classification>
  <relatedItem type="host">
    <titleInfo>
      <title>SPIE Digital Library (Books)</title>
    </titleInfo>
  </relatedItem>
  <identifier type="isbn">9780819490926</identifier>
  <identifier type="isbn">081949092X</identifier>
  <identifier type="uri">http://www.columbia.edu/cgi-bin/cul/resolve?clio10190379</identifier>
  <location>
    <url>http://www.columbia.edu/cgi-bin/cul/resolve?clio10190379</url>
  </location>
  <accessCondition type="restrictionOnAccess">License restrictions may limit access.</accessCondition>
  <recordInfo>
    <recordContentSource authority="marcorg">DLC</recordContentSource>
    <recordCreationDate encoding="marc">120502</recordCreationDate>
    <recordChangeDate encoding="iso8601">20180118181402.0</recordChangeDate>
    <recordIdentifier source="Nust- CAS-E">10190379</recordIdentifier>
  </recordInfo>
</mods>
