02020cam a2200361 a 450000100090000000300120000900500170002100600190003800700150005700800410007202000180011302000150013103500260014604000260017205000250019808200290022310000160025221000450026824500820031325000120039526000390040750400510044650506850049750600430118265000450122565000280127077300330129885601160133191000310144794200120147899900190149095201490150910190379Nust- CAS-E20180118181402.0m        d        cr  n         120502s2012    waua    sb    001 0 eng d  a9780819490926  a081949092X  a(WaSeSS)ssj0000819238  aDLCcDLCdDLCdWaSeSS 4aTK7871.85b.X53 201200a621.3815/2223bXIA 20121 aXiao, Hong.10aIntroduction to semiconductor technology10aIntroduction to semiconductor technologyh[electronic resource] /cHong Xiao.  a2nd ed.  aBellingham, Wash. :bSPIE,cc2012.  aIncludes bibliographical references and index.0 aPreface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index.  aLicense restrictions may limit access. 0aSemiconductorsxDesign and construction. 0aSemiconductor industry. 0tSPIE Digital Library (Books)40uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio10190379zFull text available from SPIE Digital Library (Books)  aLibrary of Congress record  2ddccBK  c355457d355457  00102ddc 40708NFICaCAS-EbCAS-EcGENd2013-11-11eEagle Information Booksl0o621.3815/2 XIA 2012pCAS-E0000442r2014-08-27w2014-08-27yBK