Fuel cell electronics packaging / 
edited by Ken Kuang, Keith Easler. 
 - New York :  Springer,  c2007. 
 - x, 248 p. :  ill. ;  25 cm. 
<br/><br/>0 
<br/><br/>Includes bibliographical references and index. 
<br/><br/> Presents the latest developments in the technology convergence of microelectronics and fuel cells. Using the well established manufacturing methods used in microelectronics packaging, fuel cells can be further fabricated in smaller sizes with higher energy density, at a faster pace and lower cost. 
<br/><br/><label>ISBN: </label>9780387473239 (alk. paper) 0387473238 (alk. paper) 0387473246 (eISBN) 9780387473246 (eISBN) 
<br/><br/><label>Publisher. No.: </label>11759935 
<br/><br/><label>LCCN: </label>2006939574 
<br/><br/><label>Nat. Bib. No.: </label>GBA6A5845  bnb 06,N41,0381  dnb 
<br/><br/><label>Nat. Bib. Agency Control No.: </label>013629186  Uk 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Fuel cells.<br/>Brennstoffzelle.
<br/><br/><label>LC Class. No.: </label>TK2931  / .F767 2007 
<br/><br/><label>Dewey Class. No.: </label>621.312429  / FUE 2007