Rymeszewski, E.J Tummala, Rao R <br/><br/>
Microelectronics packaging handbook 

 - NEWYORK  VAN NOSTRAND  1988 
 - 1194P 
<br/><br/><label>ISBN: </label>0-442-20578-3 
<br/><br/><label>Subjects--Topical Terms: </label><br/>MICROELECTRONICS PACKAGING-HANDBOOK,MANUALS
<br/><br/><label>Dewey Class. No.: </label>621.3817 MIC'T