Singh, Prabjit <br/><br/>
Materials developments in microelectronic packaging performance reliability proceedings of the fourth electronic materials and processing congresses 

 - USA  ASM INTERNATIONAL  1991 
 - XI, 403P 
<br/><br/><label>Subjects--Topical Terms: </label><br/>0-87170-435-8
<br/><br/><label>Dewey Class. No.: </label>621.381 MAT'E