<![CDATA[NUST Institutions Library Catalogue Search for '(su:"Thin films") AND (su:"Surfaces.")']]>

<![CDATA[NUST Institutions Library Catalogue Search for '(su:"Thin films") AND (su:"Surfaces.")']]> http://catalogue.nust.edu.pk:8081/cgi-bin/koha/opac-search.pl?q=ccl=%28su%3A%22Thin%20films%22%29%20AND%20%28su%3A%22Surfaces.%22%29&format=rss 3 0 50 Wafer Level 3-D ICs Process Technology (E-BOOK) ISBN:978-0-387-76534-1 http://catalogue.nust.edu.pk:8081/cgi-bin/koha/opac-detail.pl?biblionumber=192890 By Tan, Chuan Seng.. Boston, MA : Springer US, 2008 978-0-387-76534-1

Place Hold on Wafer Level 3-D ICs Process Technology (E-BOOK)

]]> http://catalogue.nust.edu.pk:8081/cgi-bin/koha/opac-detail.pl?biblionumber=192890 Principles of plasma discharges and materials processing / ISBN:0471720011 http://catalogue.nust.edu.pk:8081/cgi-bin/koha/opac-detail.pl?biblionumber=356039 By Lieberman, M. A.. Hoboken, N.J. : Wiley-Interscience, 2005 . xxxv, 757 p. : 25 cm.. 0471720011

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]]> http://catalogue.nust.edu.pk:8081/cgi-bin/koha/opac-detail.pl?biblionumber=356039 Materials science of thin films deposition and structure ISBN:81-312-0279-8 http://catalogue.nust.edu.pk:8081/cgi-bin/koha/opac-detail.pl?biblionumber=570828 By Ohring, Milton. NEW DELHI ACADEMIC PRESS 2006 . XIX,794 P 81-312-0279-8

Place Hold on Materials science of thin films deposition and structure

]]> http://catalogue.nust.edu.pk:8081/cgi-bin/koha/opac-detail.pl?biblionumber=570828