NUST Institutions Library Catalogue

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Wire bonding in microelectronics George G. Harman

by Harman, George G | George G. Harman.

Edition: 3rd ed. Publisher: New York Mc Graw Hill 2010Availability: Items available for loan: Central Library (CL)Call number: 621.3815 HAR (1).
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MEMS and microsystems : design, manufacture, and nanoscale engineering design, manufacture, and nanoscale engineering Tai-Ran Hsu.

by Hsu, Tai-Ran.

Edition: 2nd ed.Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: Hoboken, N.J. : John Wiley, c2008Online access: Table of contents only | Publisher description | Contributor biographical information Availability: Items available for loan: Central Library (CL)Call number: 621.381 HSU (1).
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Packaging strategy : winning the consumer / Mona Doyle.

by Doyle, Mona.

Edition: 1st ed.Material type: Text Text; Format: print Publisher: [S.l.] : CRC Press, 1996Online access: Amazon.com Availability: Items available for loan: Centre for International Peace & Stability (CIPS)Call number: 658.564 PAC 1996 (1).
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MEMS and microsystems : design, manufacture, and nanoscale engineering /

Edition: 2nd ed.Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: Hoboken, N.J. : John Wiley, Online access: Table of contents only | Publisher description | Contributor biographical information Availability: Items available for loan: School of Mechanical & Manufacturing Engineering (SMME)Call number: 621.381 HSU (2).
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Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou.

by Madou, Marc J.

Edition: 2nd ed.Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: Boca Raton : CRC Press, c2002Online access: Publisher description Availability: Items available for loan: School of Mechanical & Manufacturing Engineering (SMME)Call number: 621.38152 MAD (1).
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Electronic packaging and interconnection handbook / Charles A. Harper, editor-in-chief.

by Harper, Charles A | Harper, Charles A.

Edition: 3rd ed.Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: New York : McGraw-Hill, c2000Online access: Contributor biographical information | Publisher description | Table of contents Availability: Items available for loan: Pakistan Navy Engineering College (PNEC)Call number: 621.38'1046 HAR (1).
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Circuits, interconnections, and packaging for VLSI / H.B. Bakoglu.

by Bakoglu, H. B.

Publisher: Reading, Mass. : Addison-Wesley Pub. Co., c1990Availability: Items available for loan: Military College of Signals (MCS)Call number: 621.395,BAK (1).
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Package design : an introduction to the art of packaging / Laszlo Roth.

by Roth, Laszlo.

Publisher: Englewood Cliffs, N.J. : Prentice-Hall, c1981Availability: Items available for loan: Military College of Signals (MCS)Call number: 688.8,ROT (1).
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Nanotechnologies in food / Edited by Qasim Chaudhry, Laurence Castle and Richard Watkins.

by Chaudhry, Qasim | Castle, L | Watkins, Richard, Dr | Royal Society of Chemistry (Great Britain).

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: Cambridge : RSC, c2010Online access: Contributor biographical information | Publisher description | Table of contents only Availability: Items available for loan: Institute of Environmental Science and Engineering (IESE)Call number: 664 RSC (1).
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Fun packaging / by Miquel Abellan.

by Abellan, Miquel.

Edition: Bilingual ed.Material type: Text Text; Format: print Publisher: [S.l.] : Gingko Press Inc., 2014Online access: Amazon.com Availability: Items available for loan: School of Art Design and Architecture (SADA)Call number: 688.8068 ABE 2014 (1).
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Structural packaging : design your own boxes and 3d forms / Paul Jackson.

by Jackson, Paul.

Material type: Text Text; Format: print Publisher: : Laurence King Publishing, 2012Online access: Amazon.com Availability: Items available for loan: School of Art Design and Architecture (SADA)Call number: 688.8 JAC 2012 (1).
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Print and production finishes for packaging / Edward Denison.

by Denison, Edward.

Material type: Text Text; Format: print Publisher: [S.l.] : Rockport Publishers, 2008Online access: Amazon.com Availability: Items available for loan: School of Art Design and Architecture (SADA)Call number: 688.8 DEN 2008 (1).
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Microwave and millimeter-wave electronic packaging / Rick Sturdivant.

by Sturdivant, Rick [author.].

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: Boston : Artech House, [2014]Copyright date: ©2014Availability: No items available : Checked out (1).
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Packaging engineering.

by Barail, Louis C.

Material type: Text Text Publisher: New York, Reinhold, 1954Availability: Items available for loan: Military College of Engineering (MCE) Call number: 688.8 BAR (1).
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The electronics hand book

by Whitaker , Jerry.C.

Edition: 2NDMaterial type: Text Text; Format: print ; Literary form: Not fiction Publisher: CALIFORNIA TAYLOR AND FRANCIS 2005Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.381 ELE (1).
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Microelectronics packaging handbook

by Rymeszewski, E.J Tummala, Rao R.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: NEWYORK VAN NOSTRAND 1988Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.3817 MIC'T (1).
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Mems and microsystems , design and manufacture

by Hsu, Tai Ran.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: NEW DELHI TATA MCGRAW HILL 2002Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.381 HSU (1).
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Fundamentals of microfabrication

by Madou, Marc.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: NEW YORK CRC PRESS 2002Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.38152 MAD (2).
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Mems moems packaging

by Gilleo, Ken.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: USA MCGRAW HILL 2005Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.381046 GIL (3).
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The basics of soldering

by Ran, Armin.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: NEWYORK JOHN WILEY 1993Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.381046 RAH'B (1).
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Electronic techniques shop practices and constructio

by Avtis, A. W Megon, W. F Villanucci, R. S.

Edition: 4THMaterial type: Text Text; Format: print ; Literary form: Not fiction Publisher: NEWJERSCY PRENTICE HALL 1991Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.38104 VIL'E (1).
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Surface mount and related technologies

by Ginsberg, Gerald.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: NEWYORK MARCEL DEKKER 1989Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.38174 GIN'S (2).
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Aarea Array Packaging Materials: Adhesives, Paster, and Lead- Free

by Gilleo, Ken.

Material type: Text Text Publisher: New York: Mcgraw-Hill 2004Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.381046 GIL (2).
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Managing packaging design for sustainable development : a compass for strategic directions / edited by Daniel Hellström, Annika Olsson with contributions from professor Fredrik Nilsson.

by Hellström, Daniel [editor.] | Olsson, Annika, 1962- [editor.].

Material type: Text Text; Format: print ; Literary form: Not fiction Availability: Items available for loan: School of Art Design and Architecture (SADA)Call number: 658.564 MAN 2017 (1).
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Area Array Packaging Materials Adhesive, Pestes, and Lead- Free

by .Phd, . Gilleo Ken.

Material type: Text Text Publisher: New York: McGraw-Hill, 2004Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.38104 GIl (1).
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