Electronic assembly fabrication , chips, circuit boards, packages and components
Material type:
TextPublisher: NEW YORK MCGRAW HILL 2002Description: XV,662 PISBN: 0-07-137882-0Subject(s): ELECTRONIC ASSEMBLY FABRICATION.CHIPS, CIRCUIT BOARDS, PACKAGES AND COMPONENTSDDC classification: 621.381 HAR
| Item type | Current location | Home library | Shelving location | Call number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|
Book
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College of Electrical & Mechanical Engineering (CEME) | College of Electrical & Mechanical Engineering (CEME) | General Stacks | 621.381 HAR (Browse shelf) | Available | CEME-42470 |
Total holds: 0
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