000			01168 a2200229 4500
003			Nust
005			20221130111430.0
010			_a 86028174
020			_a0471914347 :
040			_cNust
082	0	0	_a621.38152,AME
100	1		_aAmerasekera, E. A. _969337
245	1	0	_aFailure mechanisms in semiconductor devices / _cE.A. Amerasekera and D.S. Campbell.
260			_aChichester [West Sussex] ; _aNew York : _bWiley, _cc1987.
300			_axiii, 205 p. : _bill. ; _c24 cm.
505			_aIntroduction (Page-1), Reliability Theory (Page-5), Failure Mechanisms (Page-12), Failure Mechanisms and Device Technologies (Page-66), Packing (Page-93), Screening (Page-105), Accelerated Testing (Page-116), Physical Failure Analysis Technology (Page-121), Reliability Prediction and Failure Modeling (Page-129), Quality Assurance (Page-135), Conclusions (Page-143).
650		0	_aTelecommunication Engineering
700	1		_aCampbell, D. S. _9103815
856	4	2	_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0607/86028174-d.html
856	4	2	_3Table of contents only _uhttp://www.loc.gov/catdir/enhancements/fy0607/86028174-t.html
942			_2ddc _cBK
999			_c182219 _d182219