000			01265 a2200241 4500
003			Nust
005			20221229103341.0
010			_a 87022803
020			_a0070627355 :
040			_cNust
082	0	0	_a621.395.VLS
245	0	0	_aVLSI technology / _cedited by S.M. Sze.
250			_a2nd ed.
260			_aNew York : _bMcGraw-Hill, _cc1988.
300			_axii, 676 p. : _bill. ; _c25 cm.
440		0	_aMcGraw-Hill series in electrical engineering. _920188
505			_aCrystal Growth and Wafer Preparation (Page-9), Epitaxy (Page-55), Oxidation (Page-98), Lithography (Page-141), Reactive Plasma Etching (Page-184), Dielectric and Polysilicon Film Deposition (Page-233) Diffusion (Page-272), Ion Implantation (Page-327), Metallization (Page-375), Process Simulation (Page-422), VLSI Process Integration (Page-466), Analytical Techniques (Page-516), Assembly Techniques and Packaging of VLSI Devices (Page-566), Yield and Reliability (Page-612).
650		0	_aIntegrated circuits _xVery large scale integration. _92955
700	1		_aSze, S. M., _d1936- _935782
856	4	2	_3Publisher description _uhttp://www.loc.gov/catdir/description/mh022/87022803.html
856	4	2	_3Table of contents _uhttp://www.loc.gov/catdir/toc/mh021/87022803.html
942			_2ddc _cBK
999			_c183942 _d183942