000			01038 a2200157 4500
003			Nust
005			20221124131715.0
040			_cNust
082			_a621.38132,ADV
100			_aGerald A. Walker _9103499
245			_aAdvances in electronic circuit packaging Vol-2 / _cGerald A. Walker
260			_aNew York _bEnglewood, Colo., Rogers _c1962
300			_a381 p
505			_aMaterials for Electronic Packaging (Page-1), Controlling the Mechanical Response of Printed Circuits Boards (Page-21), A Low Density Potting Compound (Page-35), An Effective use of Castings in a Lightweight (Page-52), Heat Sinks and Encapsulates for Volumetric Packing (Page-61), Potting Problems Related to Packing Design (Page-77), Packing of Semiconductor Networks (Page-91),Theremal packing for Transient Operation (Page-104), Formulation and Solution of the Circuit Card Design Problems (Page-121), Maintainable Electronic Component Assemblies (Page-143), Electronic Packing (Page-166), Packing of a Telemeter to Withstand (Page-181),
942			_2ddc _cBK
999			_c194129 _d194129