000			01837cam a22003977a 4500
001			16626316
003			OSt
005			20211021103124.0
008			110127s2011 nyua b 001 0 eng
010			_a 2011921730
015			_aGBB047220 _2bnb
016	7		_a015523393 _2Uk
020			_a9780387473161 (hbk.)
035			_a(OCoLC)ocn587110610
038			_akhadija
040			_aUKM _cUKM _dBTCTA _dYDXCP _dINT _dVLB _dDLC
042			_alccopycat
050	0	0	_aTJ163 _b.M46 2011
082	0	4	_a621.381 _222 _bMEM
245	0	0	_aMEMS materials and processes handbook / _cReza Ghodssi, Pinyen Lin, editors.
260			_aNew York ; _aLondon : _bSpringer, _cc2011.
300			_axxxv, 1187 p. : _bill. ; _c24 cm.
490	1		_aMEMS reference shelf
504			_aIncludes bibliographical references and index.
505	0		_aThe MEMS design process -- Additive processes for semiconductors and dielectric materials -- Additive processes for metals -- Additive processes for polymeric materials -- Additive processes for piezoelectric materials : piezoelectric MEMS -- Materials and processes in shape memory alloy -- Dry etching for micromachining applications -- MEMS wet-etch processes and procedures -- MEMS lithography and micromachining techniques -- Doping processes for MEMS -- Wafer bonding -- MEMS packaging materials -- Surface treatment and planarization -- MEMS process integration.
563			_aHardcover
650		0	_aMicroelectromechanical systems _xMaterials. _983310
650		0	_aMicroelectromechanical systems. _955756
700	1		_aGhodssi, Reza. _983311
700	1		_aLin, Pinyen. _983312
830		0	_aMEMS reference shelf. _983313
906			_a7 _bcbc _ccopycat _d2 _encip _f20 _gy-gencatlg
942			_2ddc _cBK
999			_c33242 _d33242