| 000 | 03182cam a2200349 a 4500 | ||
|---|---|---|---|
| 001 | 16208181 | ||
| 003 | OSt | ||
| 005 | 20211029182815.0 | ||
| 008 | 100428s2010 njua b 001 0 eng | ||
| 010 | _a 2010018381 | ||
| 020 | _a9780470496626 (hbk. : alk. paper) | ||
| 038 | _akhadija | ||
| 040 |
_aDLC _cDLC _dDLC |
||
| 042 | _apcc | ||
| 050 | 0 | 0 |
_aTJ255.5 _b.L44 2010 |
| 082 | 0 | 0 |
_a621.4025 _222 _bLEE |
| 100 | 1 |
_aLee, HoSung. _983557 |
|
| 245 | 1 | 0 |
_aThermal design : _bheat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells / _cHoSung Lee. |
| 260 |
_aHoboken, NJ : _bWiley, _cc2010. |
||
| 300 |
_axviii, 630 p. : _bill. ; _c25 cm. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 520 | _a"The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided"-- | ||
| 520 | _a"The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics"-- | ||
| 563 | _aHardcover | ||
| 650 | 0 |
_aHeat engineering _xMaterials. _983558 |
|
| 650 | 0 |
_aHeat-transfer media. _983559 |
|
| 650 | 0 |
_aThermodynamics. _97134 |
|
| 650 | 0 |
_aThermoelectric apparatus and appliances. _983560 |
|
| 906 |
_a7 _bcbc _corignew _d1 _eecip _f20 _gy-gencatlg |
||
| 942 |
_2ddc _cBK |
||
| 999 |
_c33412 _d33412 |
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