000			01859cam a2200349 a 4500
001			10190379
003			Nust- CAS-E
005			20180118181402.0
006			m d
007			cr n
008			120502s2012 waua sb 001 0 eng d
020			_a9780819490926
020			_a081949092X
035			_a(WaSeSS)ssj0000819238
040			_aDLC _cDLC _dDLC _dWaSeSS
050		4	_aTK7871.85 _b.X53 2012
082	0	0	_a621.3815/2 _223 _bXIA 2012
100	1		_aXiao, Hong.
210	1	0	_aIntroduction to semiconductor technology
245	1	0	_aIntroduction to semiconductor technology _h[electronic resource] / _cHong Xiao.
250			_a2nd ed.
260			_aBellingham, Wash. : _bSPIE, _cc2012.
504			_aIncludes bibliographical references and index.
505	0		_aPreface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index.
506			_aLicense restrictions may limit access.
650		0	_aSemiconductors _xDesign and construction.
650		0	_aSemiconductor industry.
773		0	_tSPIE Digital Library (Books)
856	4	0	_uhttp://www.columbia.edu/cgi-bin/cul/resolve?clio10190379 _zFull text available from SPIE Digital Library (Books)
910			_aLibrary of Congress record
942			_2ddc _cBK
999			_c355457 _d355457