000			02069cam a22004937a 4500
001			14653501
003			USPCAS-E
005			20180118181411.0
008			061201s2007 nyua b 001 0 eng
010			_a 2006939574
015			_aGBA6A5845 _2bnb
015			_a06,N41,0381 _2dnb
016	7		_a013629186 _2Uk
020			_a9780387473239 (alk. paper)
020			_a0387473238 (alk. paper)
020			_a0387473246 (eISBN)
020			_a9780387473246 (eISBN)
028	5	2	_a11759935
035			_a(OCoLC)ocm77256590
040			_aUKM _cUKM _dBAKER _dBTCTA _dYDXCP _dIWA _dIXA _dNDD _dDEBBG _dVA@ _dBDX _dDLC
042			_aukblsr _alccopycat
050	0	0	_aTK2931 _b.F767 2007
082	0	4	_a621.312429 _222 _bFUE 2007
084			_a540 _2sdnb
084			_aELT 972f _2stub
084			_aVN 6050 _2rvk
084			_aZN 8750 _2rvk
245	0	0	_aFuel cell electronics packaging / _cedited by Ken Kuang, Keith Easler.
260			_aNew York : _bSpringer, _cc2007.
300			_ax, 248 p. : _bill. ; _c25 cm.
502			_a0
504			_aIncludes bibliographical references and index.
520			_aPresents the latest developments in the technology convergence of microelectronics and fuel cells. Using the well established manufacturing methods used in microelectronics packaging, fuel cells can be further fabricated in smaller sizes with higher energy density, at a faster pace and lower cost.
650		0	_aFuel cells.
650	0	7	_aBrennstoffzelle. _2swd
700	1		_aKuang, Ken.
700	1		_aEasler, Keith.
856	4	2	_qtext/html _uhttp://deposit.d-nb.de/cgi-bin/dokserv?id=2855552&prov=M&dok_var=1&dok_ext=htm _3Inhaltstext
856	4	2	_3Publisher description _uhttp://www.loc.gov/catdir/enhancements/fy0825/2006939574-d.html
856	4	1	_3Table of contents only _uhttp://www.loc.gov/catdir/enhancements/fy0825/2006939574-t.html
906			_a7 _bcbc _ccopycat _d2 _eepcn _f20 _gy-gencatlg
942			_2ddc _cBK
999			_c355733 _d355733