000 01577cam a2200385 a 4500
001 13749338
003 USPCAS-E
005 20180118181421.0
008 041013s2005 njua b 001 0 eng
010 _a 2004058503
020 _a0471720011
035 _a(OCoLC)ocm56752658
040 _aDLC
_cDLC
_dIAY
_dC#P
_dOCL
_dIXA
_dBAKER
_dDLC
050 0 0 _aQC718.5.D9
_bL54 2005
082 0 0 _a530.44
_222
_bLIE-P 2005
100 1 _aLieberman, M. A.
_q(Michael A.)
245 1 0 _aPrinciples of plasma discharges and materials processing /
_cMichael A. Lieberman, Allan J. Lichtenberg.
250 _a2nd ed.
260 _aHoboken, N.J. :
_bWiley-Interscience,
_cc2005.
300 _axxxv, 757 p. :
_bill. ;
_c25 cm.
502 _a.
504 _aIncludes bibliographical references (p. 735-748) and index.
650 0 _aPlasma dynamics.
650 0 _aThin films
_xSurfaces.
650 0 _aPlasma etching.
650 0 _aPlasma chemistry
_xIndustrial applications.
700 1 _aLichtenberg, Allan J.
856 4 2 _3Contributor biographical information
_uhttp://www.loc.gov/catdir/enhancements/fy0618/2004058503-b.html
856 4 2 _3Publisher description
_uhttp://www.loc.gov/catdir/enhancements/fy0618/2004058503-d.html
856 4 1 _3Table of contents only
_uhttp://www.loc.gov/catdir/enhancements/fy0618/2004058503-t.html
906 _a7
_bcbc
_corignew
_d1
_eocip
_f20
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942 _2ddc
_cBK
999 _c356039
_d356039